SKTD Series SKTDLDE010

Taping

• Number of packages (pcs.)

• 
  

• 1 reel

• 4,500

• 1 case / Japan

• 45,000

• 1 case / export packing

• 45,000

• Tape width (mm)

• 12

• Export package measurements (mm)

• 395×395×205

Condition for Reflow

1. Heating method
   Double heating method with infrared heater.

2. Temperature measurement
   Thermocouple 0.1 to 0.2 Φ CA(K) or CC(T) at solder joints (copper foil surface). A heat resisting tape should be used for fix measurement.

3. Temperature profile

(1) The above temperature shall be measured of the top of switch. There are cases where PC board’s temperature greatly differs from that of the switch, depending on the material, size, thickness of PC board’s and others. Care, should be taken to prevent the switch’s surface temperature from exceeding 260℃.
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.

Manual Soldering

• Soldering temperature

• 350℃ max.

• Duration of soldering

• 3s max.

• Capacity of soldering iron

• 20W max.

1. Do not washing the TACT Switch™.

2. Prevent flux penetration from the top side of the TACT switch™.

3. Switch terminals and a PC board should not be coated with flux prior to soldering.

4. The second soldering should be done after the switch returns to normal temperature.