ID-Multi（Top Entry Type）　Series Wire to Board ID Method Connectors

Features

• 1. Small and low profile type wire to board ID method connector of 0.8mm pitch and 1.2mm mating height.

• 2. Due to original contact design, supports multiple pin connections.

• 3. Resistant to vibration and shocks when dropped and highly reliable due to a 2point contact structure.

• 4. Cable connection helping to achieve excellent cable retention performance and contact reliability due to double insulation displacement slots at the front and back.

• 5. A top entry mating structure where the wire emerges horizontally.

• 6. Excellent mating retention force in addition to ensured clicking feeling during insertion and withdrawal due to the mold locking structure.

• 7. Supplied in the embossed taping with automatic mounter.

• 8. Country of Origin：Japan, China

Specification

Material and Plating

Application

1. Mobile phones, smartphones, digital cameras, PDAs, and other mobile equipment.